Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, and Europe. It offers packages, such as flip-chip ball grid array (BGA), flip-chip CSP, advanced chip scale packages, and IC wirebonding packages; stacked die solutions in various package types, such as stacked die quad flat no-lead and hybrid BGAs containing stacked wire bond and fc die; and copper wire bonding solutions, as well as module assembly services, and interconnect materials. The company's testing services include front-end test engineering testing, wafer probing, logic/mixed-signal/RF/discrete final testing services, memory final testing services, other test related services, and drop shipment services. It also offers electronics manufacturing services for use in a range of end-use applications, primarily computers, peripherals, communications, industrial applications, automotive electronics, and storage and server applications. It offers package and testing services for a range of products with end-use applications in the communications, computers, consumer electronics, industrial, and automotive sectors. The company was founded in 1984 and is based in Kaohsiung, Taiwan.