Chip Scale Package Stocks List

Related ETFs - A few ETFs which own one or more of the above listed Chip Scale Package stocks.

Chip Scale Package Stocks Recent News

Date Stock Title
Nov 1 AMKR Bear Of The Day: Amkor Technology (AMKR)
Oct 31 ASX ASE Technology Holding Co., Ltd. 2024 Q3 - Results - Earnings Call Presentation
Oct 31 ASX ASE Technology Holding Co., Ltd. (ASX) Q3 2024 Earnings Call Transcript
Oct 31 ASX ASE Technology Hldg: Q3 Earnings Snapshot
Oct 31 ASX ASE Technology reports Q3 results
Oct 31 ASX ASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the Third Quarter of 2024
Oct 30 AMKR Eagles’ Lurie in Talks to Sell Stake in NFL Team to Family Behind Amkor Technology
Oct 30 ASX ASE Technology Q3 2024 Earnings Preview
Oct 30 CAMT CAMTEK TO REPORT THIRD QUARTER 2024 FINANCIAL RESULTS ON TUESDAY, NOVEMBER 12, 2024
Oct 30 AMKR Amkor Technology Third Quarter 2024 Earnings: Revenues Beat Expectations, EPS Lags
Oct 29 AMKR Why Amkor (AMKR) Shares Are Trading Lower Today
Oct 29 AMKR Q3 2024 Amkor Technology Inc Earnings Call
Oct 29 AMKR Amkor Q3 Earnings Miss: Will Dim Q4 Guidance Pull Down the Stock?
Oct 29 AMKR Amkor Technology's Q3 Earnings Pack Sales Growth But Margins Compress
Oct 29 AMKR TransMedics Group Posts Weak Results, Joins Harmonic, Crocs, D.R. Horton And Other Big Stocks Moving Lower In Tuesday's Pre-Market Session
Oct 29 CAMT Should You Investigate Camtek Ltd. (NASDAQ:CAMT) At US$79.16?
Oct 29 AMKR Why VF Corp Shares Are Trading Higher By Around 21%; Here Are 20 Stocks Moving Premarket
Oct 29 AMKR Amkor Technology Inc (AMKR) Q3 2024 Earnings Call Highlights: Strong Revenue Growth Amid Market ...
Oct 29 AMKR Amkor Technology: Advanced Packaging And TSMC Partnership, Initiate With Buy
Oct 29 AMKR Amkor Technology, Inc. (AMKR) Q3 2024 Earnings Call Transcript
Chip Scale Package

A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable in 1993. The first concept demonstration however came from Mitsubishi Electric.The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale package (WL-CSP). WL-CSP had been in development since 1990s, and several companies begun volume production in early 2000, such as Advanced Semiconductor Engineering (ASE).

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