Flip Chip Stocks List
Symbol | Grade | Name | % Change | |
---|---|---|---|---|
AMKR | F | Amkor Technology, Inc. | -4.84 | |
FORM | F | FormFactor, Inc. | -3.98 | |
ASX | D | Advanced Semiconductor Engineering, Inc. | -1.74 | |
KLIC | D | Kulicke and Soffa Industries, Inc. | -2.79 |
Related Industries: Semiconductor Equipment & Materials Semiconductors
Symbol | Grade | Name | Weight | |
---|---|---|---|---|
PSI | C | PowerShares Dynamic Semiconductors | 5.1 | |
FTXL | C | First Trust Nasdaq Semiconductor ETF | 4.17 | |
PSCT | C | PowerShares S&P SmallCap Information Technology Portfolio | 3.64 | |
AADR | B | WCM BNY Mellon Focused Growth ADR ETF | 2.46 | |
PTF | C | PowerShares Dynamic Technology | 1.59 |
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- Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.
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